2002

BIWI SA acquired Précel SA, owned by Kudelski which in particular manufactured the electronic parts for NAGRA devices. The Electronic Division of BIWI SA was established and located in Glovelier.

2003-2004

A purchasing center was created. The whole activity was structured and implemented around a new organization, larger and capable of providing all the usual services in terms of outsourcing in electronics assembly.

A new management and production team were formed. Approximately 16 people were employed.

The production tool was complete. Including an online control system by image analysis (AOI), and the SMD line was ​​compatible with 0201 component technology.

The number of clients regularly increased.  Loyalty and a long-term partnership were part of the basic commercial approach.

2006

At the beginning of the year, thanks to the acquisition of a new convection oven and a new wave soldering machine, and after the validation of a process in collaboration with a prestigious company in the aeronautical field, we were able to offer our customers, as standard production, RoHS compliant products.
Work in 2 shifts was organized permanently.
The integration of a modern ERP was provided through the purchase of the product TopManufacturing from Missler (Oracle database).

2007

On the 1^st of January, the Electronic Division of BIWI SA became independent and LOCATIS SA was formed. Specific products were integrated with PB100 and PB200 devices.

On the 1^st of March, LOCATIS SA moved into its brand new premises in Bassecourt. Production was reorganized with the 1,000 m2 available and the geometry of the workflow was perfect. The SMD line especially benefited from an air conditioned “grey –room”.

An additional JUKI 2060 placer was acquired and our capacity to place SMD components was increased to 50 million / year and improved the subtleties of removal. Despite the increased capacity, we still needed to maintain 2 shifts to absorb the strong growth in volume.

At year end, LOCATIS SA had 25 employees.

2008

A re-certification audit was carried out by the SQS (Swiss Association for Quality and Management Systems) who granted LOCATIS SA the ISO13485 and ISO9001 certification under the new company name.

2009-2011

The financial crisis, the strength of the Swiss Franc and then the disaster in Japan, in turn worsened the market situation and created a severe and continued shortage of components.

Some customers immediately stopped their product orders. They were often already stocked up or stock was already being consumed in their workshops. Yet, at the same time, other customers were placing orders which were unfortunately impossible to satisfy due to repeated delays in component deliveries.
 

LOCATIS SA was flexible and financially managed to bear the cost of the masses of components received which temporarily could not be processed. The company looked to diversify, in particular, to manage comprehensive projects and manufacture complete devices. The concept of becoming an Integrated Partner was developed.

2011-2013

Prospects gradually improved. In many ways, it was now time to catch-up for lost time.

An additional JUKI 2070 placer was acquired to meet even more advanced technical requirements and production growth. The SMD placement capacity increased to over 60 million components / year.

An all option DEK HORIZON screen printer was acquired to conform to the sizes of paste deposits also more sophisticated and increasingly demanding.

The compatibility of the SMD tool with 020, μBGA technologies etc , was improved and generalized (20 additional specific feeders were acquired)

A large SWISS VACCUM oven was purchased to improve the time and the quality of drying for components and PCB before use.

A DIMA machine was purchased which allowed the automated coating of lacquer to tropicalize products and cards.

An additional storage area of 160 m2 was created above our offices, with a lift for access. Our total area became 1,200 m2.

The ERP was updated and became TopSolidERP. The stamping processes were automated and control of time allocated / spent and the precision of forecasted load rates improved.

The year 2012 was a historical record in terms of turnover and order entry. In 2013 these records were broken again. On the 1^st of January 2014, the level of open orders was the highest ever in the history of LOCATIS SA.

2014

New investments were commissioned, including:

- New laser selective soldering machine in order to automate the soldering of THT (Through-Hole Technology) components
- Additional AOI 3D for SMD line
- Visual checkpoints by camera and screen (replacing binocular)
- Installation of smoke extractors
- LED lighting on all conventional cell production assembly units
- Expansion of mechatronics area and various refurbishments

The sale of Geolocation products was abandoned.

2015-2021

New investments were commissioned, including:

- New placer PANASONIC MPNW2 double beam for a capacity >100 000 000 components / year
- New selective wave soldering for the THT components
- New simplified 2D AOI for small batches or AQL final controls